Solutions

AI 5G Communication

The "blood vessels (high-speed signals) + heart (high-current power supply) + lungs (efficient heat dissipation) + skeleton (structural shielding)" of AI servers. Xingye Copper Alloy offers a full-chain copper alloy solution in the AI field, spanning from CPU Socket → DDR → GPU interface → optical module → liquid cooling → power busbar → chip packaging High-density high-speed CPU Socket + DDR5 Slot + SXM Socket (for GPU module): XYK-32 + XYK-5 + XYK-65 High-speed optical module spring + housing: XYK-33+C7701 Efficient liquid cooling + high-current power distribution: C1100 + XYK-24 Address the operational requirements of AI servers/data centers for "high power consumption, high density, high heat, and high-speed signals," reducing signal loss, increasing bandwidth density, enduring prolonged operation at 125°C, and minimizing downtime risks.